| Product | Cable and / or Pin Attachment | Cable or Interface Type | Cable, PCB, Receptacles | Case Size | Color | Complex Shape | Compound | Conductive Orings | Connector Series | Contact Pins # | Density [g/cm3] | Description | Diameter | Dimensions | External Diameter | EXTRUSION | Gender | Hardness (Shore 00) | Hardness (Shore A) | Height - mm | Impedance | Internal Diameter | Isolated Ground or Hermetic | Length | Material Type | Mating Method | MIL C 26482 | MIL C 38999 | MIL C 81511 | Mount Method | Operation Temperature [°C] | Oring Solid | Phase Change Temperature [°C] | Polarity | Shell Size | Standard / Precision | Straight / Right Angle | TCS Ref | Thermal Conductivity | Thickness | Thickness Range | Width | View Details: |
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| Basics of Ferrite Beads | |||||||||||||||||||||||||||||||||||||||||||
| High Frequency Power Magnetics Technology Roadmap | |||||||||||||||||||||||||||||||||||||||||||
| Low Loss 67 Material for High Frequency Power Applications | |||||||||||||||||||||||||||||||||||||||||||
| The Basic Principles of Shielding | |||||||||||||||||||||||||||||||||||||||||||
| Thin Self-Resonant Structures with a High-Q for Wireless Power Transfer | |||||||||||||||||||||||||||||||||||||||||||
| Viz-Bond™ Optical Bonding for Displays |
EMI RFI Technical
EMI RFI Technical Information
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